The Briz Test & Programming station is a compact, totally customizable, all-in-one test station. It can be configured to perform in-circuit, functional & boundary testing, and in-system programming. So, in one manufacturing stage you can achieve the highest level of test coverage, perform device programming, and meet & exceed your throughput requirements. This makes BRIZ a truly an affordable tester that you cannot afford to be without.

Equipped with a quick changeover, mechanical tester fixture the need for a vacuum pump is eliminated. This allows the BRIZ to be quickly and easily deployed at various locations across the production floor.

Test Capability
Ensure the highest level of test coverage by using a combination of boundary scan, in-circuit and functional test techniques.

The Briz is powered by Acculogic’s powerful & patented boundary scan system. This allows fast programming of on board devices using JTAG/boundary scan ports. In addition, the Briz is equipped with auxiliary, ultra-fast, universal In-System Programmer, which enables device programming for devices that are not JTAG/1149.x compliant. The built in multiplexer permits programming multiple devices in parallel.

The BRIZ is designed to be configurable with a variety of off the shelf test instrumentation for performing functional test:
– VXI, PXI, and GPIB based instrumentation for analog & digital functional test
– LabWindows CVI™, Labview™, Visual C/C++, etc.


Why’s Solder Paste Inspection Critical?

Solder Paste Inspection is primarily done to examine the solder paste deposits in the Printed Circuit Board (also called Printed Circuit) fabrication course of action. It is known that almost all the solder joint defects in a Printed Circuit Board assembly are because of incorrect solder paste printing. By making usage of solder paste inspection (SPI), you can actually lower the defects associated with soldering by a tremendous amount. This post will confirm the power of SPI process and how significant it is .

Importance of Solder Paste Inspection Process

The following are some of the key points of information, which show the importance of SPI process:

Improves Printed Circuit Quality & Performance

This process makes use of modern equipment for exact inspection. Angle cameras are utilized to take 3 dimensional photographs, which are extremely helpful in measuring the alignment and volume of the solder paste. This will help to increase the yield, and the print quality. What is more, it helps strengthen the performance of the Printed Circuits.

High tech Equipment for Better Management & Watching

As pointed out before, angle cameras are employed, which present clear 3D pictures. Different from the regular cameras, 3D cameras are capable of grabbing the height of the solder paste printed. This makes it possible for precise measurement of the solder paste volume. Accordingly, through the help of SPI plus automated optical inspection(AOI ), manufacturers can easily keep tabs on and manipulate the part placement and solder paste printing processes.

Helps In Reducing Solder Errors

Critical information regarding the printing process can be obtained by performing the solder paste inspection. It offers a apparent idea regarding the factors that cause defects, and thus allowing you to make the necessary changes and lessen the errors to a minimum.

All the factors cited above make manufacturers do the SPI process to produce high-quality Printed Circuits. The inspection process not only helps produce defect-free Printed Circuits, but also saves big costs. Furthermore, it additionally helps lower the delivery time of the manufacturers. This clearly shows the importance of solder paste inspection process. For an error-free solder, it is therefore, a good idea to implement SPI.

For more info regarding Solder Paste Inspection, You can get it done by an expert similar to MOKO Technology. The company is situated in Asia , and offers services in solder paste inspection, as well as Printed Circuit design and manufacturing.

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